Interpac to attend Digital Packaging Summit 2025 in Florida

Interpac will be attending the Digital Packaging Summit 2025 in Ponte Vedra Beach, Florida on 10–12 November 2025.

If warped board is slowing production or damaging print heads, cold corrugation offers a new solution.

George Perreira from Interpac North America will be attending and discussing how Interpac’s technology enables digital printers and sheet plants to produce board with:

• Next to zero warp
• Ultra-smooth surfaces for high-quality print
• Complete control over board supply

The Interpac 1250 is the world’s first cold corrugator designed specifically for digital printers and sheet plants.

To arrange a meeting with George ahead of the show, contact:
+1 (905) 867-6944
george.p@interpacna.com

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